Industry News | 2019-06-16 19:27:43.0
CyberOptics will present at SEMICON West, at the Moscone Center in San Francisco, CA on July 10 in the North Hall E, Room 20 at 11:25 a.m. The company also will exhibit at the show in booth #5769.
Industry News | 2019-08-27 22:31:58.0
CyberOptics® Corporation will present at SEMICON Taiwan. The company will also exhibit at the show in booth # L0310.
Industry News | 2015-01-05 20:09:12.0
Speedprint Technology will highlight the SP710 Screen Printer at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Wednesday, January 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Speedprint representatives will discuss the benefits of the SP710, Advanced Dispense Unit +, Velocity Plus and SPI communication system.
Industry News | 2015-05-26 20:43:36.0
Speedprint Technology will highlight the SP710 Screen Printer at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 25, 2015 at the Marriott Minneapolis Southwest in Minnetonka, MN. Speedprint representatives will discuss the benefits of the SP710, Advanced Dispense Unit +, Velocity Plus and SPI communication system.
Industry News | 2019-08-27 22:31:42.0
CyberOptics® Corporation will present at SEMICON Taiwan. The company will also exhibit at the show in booth # L0310.
Industry News | 2009-10-01 12:31:51.0
DENVER — October 2009 — Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from key suppliers at the upcoming Space Coast SMTA Expo and Barbeque, scheduled to take place Wednesday, November 4, 2009 from 10 a.m.-3 p.m. at the Lagoon House Education Center in Palm Bay, FL. Products from Chromerics, Cytec, Dow Corning, FCT Assembly, Humiseal, Huntsman, Henkel/Loctite, Lord, MicroCare Corporation, Permabond, Techcon Systems, and Techspray will be on display in Krayden’s booth.
Industry News | 2009-05-29 10:24:24.0
NASHVILLE � May 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will highlight AQUANOX� A4241 and METALNOX� M6319US in booth 643 at the upcoming Medical Design & Manufacturing East, scheduled to take place June 9-11, 2009 at the Jacob K. Javits Convention Center in New York, NY.
Industry News | 2012-10-26 14:02:46.0
VJ Electronix, Inc. announces that Al Cabral will present the latest approaches to micro-Rework and X-ray inspection at the upcoming technology symposium hosted by Anglo Production Processes, scheduled to take place Tuesday, November 6, 2012 during the APP – 2012 Technology Week in Bromsgrove, UK.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
