Electronics Forum | Mon Jul 03 13:25:49 EDT 2000 | Ramon I Garcia C
good morninrg Sal: I think if you try with no windows shape, maybe if you redce 10% (5% per side ;5% one side & 5% other side, total 10 % )
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
Electronics Forum | Tue Sep 08 13:12:05 EDT 2020 | spoiltforchoice
> Tombstone is often caused by an imbalance of > temperature, pad shape or spacing, component > termination, and component positioning. Pate > formulation and reflow atmosphere are other > common causes. Looking at the pads and &
Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick
Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Fri Aug 13 13:47:52 EDT 1999 | Brian Wycoff
| | | | | Hello | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | 100 durometer
Electronics Forum | Fri Aug 13 13:50:53 EDT 1999 | Brian Wycoff
| | | | | | Hello | | | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | | 100 du
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
