Electronics Forum | Fri May 22 18:10:12 EDT 2015 | cohlmann
Thanks for all of the input. It's been very helpful and given me a few more things to research.
Electronics Forum | Tue Oct 27 13:43:50 EDT 2015 | atekcare
Curious what you ended up deciding on for your production line? Did you complete this effort? Do you still need to fill a need?
Electronics Forum | Wed Nov 06 12:52:24 EST 2002 | Chris Lampron
Hello Everyone, I have been noticing a trend. Many tray packaged parts are now being supplied with velcro straps to secure the trays. Am I wrong in thinking that this is a major source of static electricity? All of these components are BGA, QFP, TSOP
Electronics Forum | Tue Jan 31 14:30:38 EST 2006 | Chunks
There is none, since we don't know your part or temp being used. A heat gun CAN be used to remove parts with no damage, if its controled. You need to look up your part on the manufacturers web site, find the process data (time/temp)the part is desi
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Fri May 15 10:12:21 EDT 2015 | capse
I'm the Rep for Vitronics Soltec and ASYS EKRA in the southeastern US. I suggest you take a look at Vitronics ovens. The AutoSet feature makes new profile development as easy as possible without buying a third party accessory, The new EKRA user inter
Electronics Forum | Fri May 15 12:41:48 EDT 2015 | deanm
I chose a Vitronics XPM3i primarily for the AutoSet automatic profile generation feature. We are high mix and simply cannot profile every board. The AutoSet feature is quick, easy and we rely on it 100% and have great results. These ovens have had ve
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson
N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa
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