Industry News: bga and reflow and temperature (Page 11 of 20)

KIC to Participate in SMART Group Temperature Profiling Workshop and Demonstrate New Generation Thermal Profiler

Industry News | 2008-10-20 20:29:37.0

San Diego � October 2008 � KIC, the leader of thermal process development and control products and winner of multiple industry awards, will participate in the SMART Group's Practical Step-by-Step Temperature Profiling Workshop, which will be held at The Oxfordshire in Thame, Oxford in the UK on 28th October. Repeatable temperature profiling is at the heart of any good process and the event will address reflow, selective, wave soldering, rework and curing profiles.

KIC Thermal

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

APS Novastar Introduces Automated Vision Control for L-Series Pick and Place Systems

Industry News | 2008-10-07 12:56:56.0

APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.

DDM Novastar Inc

BTU to Show the PYRAMAX™ Vacuum Reflow Oven and AQUA SCRUB Flux Management at APEX

Industry News | 2020-01-07 11:25:34.0

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020, at the San Diego Convention Center in California. The team will showcase both the PYRAMAX™ Vacuum reflow oven and the AQUA SCRUB flux management in Booth #3119.

BTU International

Bob Willis PoP and BGA Inspection Webinars sponsored by Nordson DAGE

Industry News | 2010-08-27 07:25:03.0

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.

ASKbobwillis.com

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Industry News | 2021-07-27 15:49:00.0

BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

BTU International

KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum

Industry News | 2024-02-12 14:28:55.0

KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum. The event will take place on Tuesday, March 19, 2024 at the Plano Event Center.

KIC Thermal

BTU's Fred Dimock to Participate in 'Automation and Energy Conservation in the Reflow Process' Panel Discussion

Industry News | 2020-05-12 12:57:11.0

BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will participate in a live panel discussion on Tuesday, May 19, 2020. The discussion entitled, "Automation and Energy Conservation in the Reflow Process," will be hosted by Global SMT & Packaging magazine.

BTU International

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

ACI Technologies Conducts Hands-on Profiling and Solder Reflow Course with KIC Equipment

Industry News | 2016-11-17 19:00:21.0

KIC today announced that ACI Technologies will host a “Profiling and Solder Reflow: Electronics Manufacturing Skills Training” from Nov. 21-22, 2016. The hands-on training will be conducted on KIC’s automated thermal process tools and systems, and will provide personnel with the knowledge and skills necessary to setup and operate a reflow process. Upon completion students will be able to apply their knowledge of reflow soldering techniques by successfully identifying the heat transfer modes and systems for each reflow method covered.

KIC Thermal


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