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2710

2710

New Equipment | Component Programming

7th Gen Manual Programmer with Two Sites Performance  The 2710 Manual Concurrent Programming System® is designed for today’s microcontrollers with their long programming times. Used in combination with FX4™ socket modules, the 2710

BPM Microsystems, Inc.

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

New Equipment | Board Handling - Storage

Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing

SMT Dry Cabinets by Eureka Dry Tech

SVX-2000

New Equipment |  

SUPERIOR VISION & X-RAY 2000 Advanced Inspection of Your Printed Wiring Assemblies (PWA) Including Ball Grid Array (BGA) and Other Hidden Features Photon Dynamics Superior Vision & X-ray (SVX) 2000 completely inspects PWAs inside and out. Using adv

Photon Dynamics

HITACHI PXH-1 Screen Printer

HITACHI PXH-1 Screen Printer

New Equipment | Printing

With its compact size, high-speed and high precision, the machine achieves a high level of cost-performance. PXH-1 is a high-performance screen printer that enables high speed and high accuracy printing within a compact frame. The PXH-1 printer is

Hitachi High Technologies America, Inc.

Lead Free Technology For Electronic Assemblies Problems and Promises

New Equipment |  

Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn

Ray Prasad Consultancy Group

SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant

New Equipment | Materials

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes

YINCAE Advanced Materials, LLC.

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

Thick-Copper PCB

Thick-Copper PCB

New Equipment | Assembly Services

Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-

NextPCB-Reliable Multilayer Boards Manufacturer

PACE TF 2800 BGA/SMD Rework System for Extra Large Boards

PACE TF 2800 BGA/SMD Rework System for Extra Large Boards

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

See how PDR IR-C3 Chipmate really works!

See how PDR IR-C3 Chipmate really works!

Videos

This video is for the PDR IR-C3 Chipmate 2000 Rework system/station - Operational Video. It gives you an overview and shows you the basics of how to operate your PDR IR-C3 Rework system. www.pdr-rework.com

PDR-America


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See Your 2024 IPC Certification Training Schedule for Eptac

Reflow Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

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