Electronics Forum | Fri Oct 03 16:51:06 EDT 2008 | waveroom
If this is a one time rework might I suggest farming it out? 100pin QFP can be taken off no problemo.. Putting it back down properly and then hand soldering??? I wouldn't want that job. You need excellent placement and imaging and your not going to
Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
Electronics Forum | Mon Oct 07 22:06:43 EDT 2013 | action_101
I successfully inspect solder on plcc's with angled cameras on the yestech we have. In the past I have successfully inspected for solder with angled cameras on mirtec machines for both plcc's and qfn's. Other than inspecting solder on those two types
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory
| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta
Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens
Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal
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Electronics Forum | Fri Apr 13 22:56:02 EDT 2001 | gdstanton
I've been chipping away on a solder bridging and poor fillet wetting problem for a few weeks now (new to the company) and I found two issues. First, after a review of stencil inventory, I found apertures to be oversized when compared to suggested di
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
