Customized High Reliability Heat Sink Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
LED Bench Top PCB Separator Machine For LED FR4 Aluminum PCB Boards Equipment designed to minimize board stress and avoid component damage. Three pairs of precision beveled cutting blades ensure the board does not bend or deform. The guide can be
ML-100 Manual PCB Separator（Hand Push Type） The ML-100 is suitable for a small number of PCB boards to be separated and does not require electricity or air pressure. The PCB is manually fed between the blades to separate, which is very simple and f
V Cut PCB Depaneling Aluminum Cutter Machine For LED Printed Circuit Board LED PCB Separator Features: 1. Separates panels up to 0.1" 2. The longest panel: No limit 3. Minimum board thickness of 0.024" 4. Shears boards safely with parts as clo
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
The FKN Systek K2000 XY helps reduce damage from depaneling resulting from operator fatigue. One of the major causes of board damage during PCB singulation is due misalignment or tilting of the PCB during the process. The support table on the K2000
New Equipment | ESD Control Supplies
Static charges that build up on the surface of plastic products attract dust and dirt, cause sheet and film to cling and stacked products to stick together. A sudden discharge of static can damage products like computer chips or even cause a fire or
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
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