Electronics Forum | Wed Mar 04 08:25:49 EST 2009 | scottp
I don't think anyone can give you an answer until you've had some failure analysis done. Silver migration? Dendritic growth? Tin whiskers? Lots of possibilities, but you won't know without failure analysis.
Electronics Forum | Wed Apr 29 04:57:08 EDT 2009 | davepick
It depends on the application what will be considered the biggest issue to avoid (production or longterm reliability). Tin Whiskers are bit of an unknown quantity - but a more realistic problem could be dendritic growth / electromigration forming sho
Electronics Forum | Wed Mar 25 20:44:18 EDT 2015 | gabinocf
Thanks by the information Mike, Another question for you is, the clean process must be developed even if we are using flux "no clean". Regards
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Wed Mar 29 13:43:42 EST 2006 | Wave Master Larry
LISTEN thats the problem with the engineers.The engineers at my place of employment always crack that "engineering humor" too and i hate it.Hell Edison had no formal education. I liken myself to Thomas Edison no formal education but lots of practica
Electronics Forum | Wed Jun 20 11:28:45 EDT 2001 | Steve
Fluxes that have been properly heat activated are insulative (non-reactive) during operation in the field and during environmental testing. If you are also performing a cleaning operation, the possibility of growing dendrites is so remote that it can
Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt
| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w
Electronics Forum | Mon Nov 22 10:57:25 EST 2004 | davef
On the dendritic growth over the top of the capacitor: We agree that your capacitor supplier probably did not do a very good job of cleaning process residues from their device. On the metallic fragments under the capacitor: This sounds like solder
Electronics Forum | Wed Mar 04 11:47:42 EST 2009 | patrickbruneel
I have to correct something from my previous post (before someone else corrects me). You can grow dendrites from any conductive surface (Cu, Ni etc.) but the final stage would be lower SIR. In my experience other metals except for tin do not lead to
Electronics Forum | Sat Jul 28 10:51:38 EDT 2001 | nifhail
I'm curious over what would happen if we continue to use the WS paste when dealing with uBGA. Definitely the cured flux under uBGA package couldn't be cleaned/reached and as I understand correctly they are corrosive. if that so, how long do you guys
