Industry News | 2018-01-16 10:34:16.0
Press Release: Low Temperature Reflowable Underfill Material: SMT 160L
Industry News | 2009-12-02 21:23:27.0
Altium has appointed Elinktron Technology SRL as a reseller in Romania. Elinktron will sell Altium Designer, Altium’s next generation electronics design solution, its NanoBoard series of FPGA-based development boards, and its TASKING embedded software development tool.
Industry News | 2015-01-06 16:51:10.0
Ryder Industries Ltd, the Swiss-owned EMS provider with manufacturing facilities in China, announces that it has been awarded Apple’s latest MFi 6.2 manufacturing licence with Apple Inc.
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
Industry News | 2013-01-10 12:09:49.0
A-Laser, will highlight its new laser marking capability in Booth #579 at the upcoming Medical Design & Manufacturing (MD&M) West Exposition
Industry News | 2013-04-05 11:14:05.0
A-Laser, will highlight its new laser marking capability in Booth #521 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
