Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Wed Mar 04 03:32:55 EST 2020 | tamasmagyar
Hi toki, First of all it depends on how much the company would like to invest in such a methodology. Second of all, why would you make a line to be single lane - double line one after each other, is that automotive / medical standard, not to handle
Electronics Forum | Tue Sep 05 08:40:33 EDT 2006 | CL
SMAINTECH, Good Morning, We have installed the Gridlock tooling pin with stealth mode on our DEK's. It is a hard tooling pin array that resets the height if the pin for every board. The pin comes up until it comes into contact with something then lo
Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000
Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller
Electronics Forum | Tue Oct 05 02:31:06 EDT 1999 | Eric
| | Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding
Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip
Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Thu Mar 05 03:01:06 EST 2020 | leo_dektec
Hello toki, The only factor you need to consider is the production yield. If the volume is really high, need two smt line to run continually to meet the production, then u have no choice. If the volume is not that much, then u can consider below smt
Electronics Forum | Fri Mar 06 08:32:20 EST 2020 | SMTA-Ken
Volume dictates throughput required. High-Volume = Requires redundant processes, Two Lines. Mid-Volume = Dual Lane or Two Lines. Low-Volume = Single Line. So Mid-Volume is the only volume scenario that a case for dual lane could be made. Dual Lane :
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
