Electronics Forum | Mon Jan 21 09:27:02 EST 2002 | JohnW
Here's a question for you to mull over. I've got a PCB that is 4 millimeters thick, that's about 160thou of USA money if you like it that way. The question is IPC reg's for hole fill say it should be a min of 75% hole fill and 50% on ground planes. A
Electronics Forum | Fri Dec 13 19:01:14 EST 2002 | Tooling Guy
I have heard of people using tiny lead-shot filled bags to hold down thru-hole components on circuit boards while running through a wave solder machine on selective solder pallets. How successful has this been? What kind of material is being used f
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress
All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Mon Mar 07 20:27:07 EST 2005 | KEN
Oh silver and its...improved solderability over tin / copper. BS if you ask me. Look to your flux and thermal profile for wetting spread. Ask yourself just how much "wetting spread" do you need to fill a barrel? I have the same 100% barrel fill
Electronics Forum | Thu Aug 11 13:09:11 EDT 2005 | bman
In addition to Pete's fine tips, here's one we have successfully used in similar situations as long as you're using OA flux. Get some kind of pump action spray bottle (like hair spray comes in) and fill is with some of your wave flux. Use the bottl
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
