Industry News | 2009-04-13 16:26:48.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial product distribution, assembly and solder training kits, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces its Engineering, Distribution and Training Services will be featured at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2010-11-04 14:21:08.0
Universal Instruments' Advanced Process Laboratory (APL) highlighted its Failure Analysis and Prototyping capabilities at recent regional SMTA shows, including the LI Chapter on October 13 and the Empire Chapter on October 19.
Industry News | 2015-12-22 18:25:31.0
Acculogic announces the appointment of BE FIRST TECHNOLOGY CO., LTD. as its representative throughout China and Hong Kong. BE FIRST TECHNOLOGY has locations in Beijing, Shanghai, Shenzhen, Xi'an and Chengdu.
Industry News | 2021-04-20 12:16:17.0
Valence 3508 features electromagnetic solder pump, unmatched thermal capability, rapid programming, and simplistic elegance in operation.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2019-08-21 22:09:17.0
Podimetrics and NEO Tech announced a new manufacturing partnership today to produce Podimetrics' FDA-cleared SmartMat at the NEO Tech facility in Westborough, Mass. The new manufacturing lines at NEO Tech will increase production capacity to meet the growing demand of the SmartMat.
Industry News | 2013-05-14 12:24:08.0
Multitest offers innovative approaches for test strategies of 3D ICs and Sensors – Meet Multitest at ECTC, May 28-30, Las Vegas
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2017-03-04 00:34:25.0
Knack Systems, a premium SAP consulting partner in the US, is exhibiting at the Customer Engagement and Commerce 2017 conference scheduled from 6th to 8th of March 2017 in Orlando, Florida.
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
