Electronics Forum: interconnection (Page 11 of 16)

BGA Voids

Electronics Forum | Tue Feb 12 17:57:42 EST 2008 | chef

I must ask the silly question- are you sure you deposited the correct amount of paste? Depending on aperature design-the voiding could come from a stencil that has its holes partially built up with old paste. If paste volume is guaranteed, then what

BGA Pad Cratering

Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef

IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as

What were your top go-to sources for electronics information and learning in 2018

Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef

Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson

Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part

Re: Very high interconnect density

Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian

| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an

Re: Very high interconnect density

Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon

| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control

Re: Very high interconnect density

Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F

| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro

Conformal Coating

Electronics Forum | Fri Dec 13 10:23:55 EST 2002 | davef

Bright ideas??? Bright ideas!!! I got bright ideas. In order of decreasing luminosity: * Stop installing the socket, solder the PLCC to the board, dip the board. The socket is a waste of time and money. You never replace the PLCC in the field, a

Conveyers Between SM Machines

Electronics Forum | Fri Aug 31 16:32:18 EDT 2018 | solderingpro

Conveyors allow for progressive indexing and buffer zones within an SMT line. Not only do they allow technicians improved access to machines for troubleshooting or technical support (which they are VERY Thankful for), but they allow (As many people

Re: Castellated Solder Pads

Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F

Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast


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