Electronics Forum | Fri Apr 27 11:26:53 EDT 2001 | pteerink
Check out IPC SM-785 Land pattern guidelines for SMT www.ipc.org Phil
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Tue Sep 17 08:26:28 EDT 2002 | davef
Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98
Electronics Forum | Wed May 05 08:55:26 EDT 2004 | davef
Have you used the IPC Land Calculator [ http://www.ipc.org ]? It's in 'Knowledge / Tools'.
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Tue Nov 09 14:34:25 EST 2004 | russ
Can class 3 be met without a side fillet?
Electronics Forum | Tue Nov 09 15:47:57 EST 2004 | mruzicka
What is the pitch of this PQFP?
Electronics Forum | Tue Nov 09 16:27:21 EST 2004 | davef
A PQFP208 is 20 thou [0.5 mm] pitch.
Electronics Forum | Thu Mar 10 14:31:56 EST 2005 | KT
Thanks for the info. Appreciate it.
Electronics Forum | Mon Apr 04 08:41:09 EDT 2005 | davef
It depends on the component and the land, but 0.1 inch is safe.
