Electronics Forum | Sun Sep 06 03:24:31 EDT 2020 | rsatmech
Hi All, We are frequently getting tombstone in an induction component. (0102) There is no paste offset or placement offset. PCB pad design is not as per recommendation. Stencil opening is 1:1 Same part used in two locations and both the locati
Electronics Forum | Fri Jun 29 18:43:16 EDT 2001 | procon
Dear Danial, The only stupid thought is the one left only as a thought and not asked. The size of the board and the placement of the BGA on the board could play a big factor during reflow. If you are processing boards on an edge conveyor and the boa
Electronics Forum | Fri Dec 01 13:55:44 EST 2017 | emeto
Brikainis, it looks like these vias are not plated and closed. I would say that thickness of your paste is lifting the part. Are you willing to try another stencil with ground pad apertures matching the via holes? It is probably worth trying. Anothe
Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef
Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t
Electronics Forum | Thu Feb 14 13:06:54 EST 2019 | compit
What is the best way to introduce a choke like from a drawing? Emerald often misunderstands the number of pins - pads have an irregular shape. Also with the lifting is a problem - for the nozzle 63 is too heavy and rotates when moving, the nozzle 64
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
Electronics Forum | Mon Nov 19 05:16:02 EST 2012 | ericrr
Thank you ENIAC for your comments Here is another problem (JUKI KE-750L) Which applies to 0603 (1608 metric) resistors and only resistors (mind you the board is more heavily populated with resistors) After the panel has gone through the oven, Wh
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
