Industry News: mechanical adhesive (Page 11 of 14)

Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations

Industry News | 2008-04-17 16:46:07.0

In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.

Henkel Electronic Materials

New DAGEProspector™ Micro Materials Tester Impresses with a 2020 NPI Award

Industry News | 2020-02-06 06:20:48.0

DAGE, part of Nordson ELECTRONICS SOLUTIONS,was awarded a 2020 NPI Award in the category of First Article Inspection for its new DAGE Prospector™ Micro Materials Tester. The award was presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Nordson DAGE

Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC

Industry News | 2024-02-19 12:00:05.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Indium Corporation

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

Essemtec to Debut New Placement Machine for Small and Mid-Size Production at APEX 2008

Industry News | 2008-02-29 18:12:49.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will premier the PANTERA-XV SMD placement system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

ESSEMTEC to Debut New Placement Machine for Small and Mid-Size Production at APEX 2008

Industry News | 2008-03-12 16:25:33.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the PANTERA-XV SMD placement system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

New placement machine for small to middle-sized production volumes from ESSEMTEC at NEPCON China 2008

Industry News | 2008-04-07 19:21:29.0

Essemtec is to showcase the new PANTERA�XV SMD placement machine in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

ESSEMTEC AG

Discover DEK technologies in action at National Electronics Week, Stand A10

Industry News | 2008-05-23 18:33:56.0

The DEK team is preparing to take its manufacturing solution to the inaugural National Electronics Week (NEW), being held at London�s Earls Court 2 over June 17th � 19th. In addition to showcasing powerful print platforms, Productivity Tools, precision screens, stencils and consumables on Stand A10, the mass imaging leader will also be demonstrating key technologies at the show�s Production Live! environment.

ASM Assembly Systems (DEK)

ESSEMTEC to Display New Placement Machine for Small and Mid-Size Production at SMTA International 2008

Industry News | 2008-08-07 14:16:46.0

Essemtec will exhibit the multi flexible PANTERA-XV SMD placement system in booth 211 at the upcoming SMTA International 2008 exhibition and conference, scheduled to take place August 19-20, 2008, in Orlando, FL.

ESSEMTEC AG

ESSEMTEC to Display New Placement Machine for Small and Mid-Size Production at IPC Midwest 2008

Industry News | 2008-09-16 11:54:15.0

Essemtec will exhibit the PANTERA-XV SMD placement system in booth907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

ESSEMTEC AG


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