Industry News: mid chip balling (Page 11 of 34)

CyberOptics to Present ‘High Precision Sensing Technology for Semiconductor Inspection and Measurement’ at SEMICON West

Industry News | 2019-06-16 19:27:43.0

CyberOptics will present at SEMICON West, at the Moscone Center in San Francisco, CA on July 10 in the North Hall E, Room 20 at 11:25 a.m. The company also will exhibit at the show in booth #5769.

CyberOptics Corporation

Leading Dallas CM Installs High-Performance Rework from Ersa

Industry News | 2018-09-26 12:14:05.0

Kurtz Ersa today announced that Precision Technology Inc. has purchased an Ersa HR 550 Hybrid Rework system. The rework system was successfully installed at the company’s 55,000 ft.2 facility in Plano, TX in the Dallas technology corridor. Precision Technology offers cost-competitive, high-quality and quick-turn prototypes to mid and high-volume manufacturing services.

kurtz ersa Corporation

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Industry News | 2021-01-21 09:42:44.0

YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.

YINCAE Advanced Materials, LLC.

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® core rework system at the 2012 IPC APEX Expo

Industry News | 2012-01-24 17:11:07.0

Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.

Finetech

Horizon Sales Provides Customers with ‘Hole-in-One’ Support and Service

Industry News | 2012-07-16 16:48:01.0

Horizon Sales,announces that its customer service and support is both comprehensive and long lasting.

Horizon Sales

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Industry News | 2012-10-03 16:55:18.0

Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo

Finetech

Metcal to Exhibit with SmartTec at SMT Nuremberg

Industry News | 2015-04-06 16:02:12.0

Metcal today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg Germany. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be showcased in the SmartTec Stand 321, hall 7, along with the Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal


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