Industry News | 2016-04-01 23:53:56.0
Ahead of SMT Hybrid Packaging 2016 (26 to 28 April 2016), Erhard Hofmann, MD AdoptSMT explains what the company is showcasing in Nuremberg.
Electronics Forum | Wed Jan 30 09:10:48 EST 2002 | bob_smith
Hi Dave, Sorry about that. Specifically, I am referring to radial leads on a crystal. The leads are supposed to be gold plated but only 1/2 to 2/3 of the lead is plated. We bend the lead to form a foot which is soldered to a pad on the PCB. Normally
Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Mon Apr 29 05:28:55 EDT 2002 | ianchan
Hi, does that rosy cheeked sales vendor of yours, have a website I can review? do they have online info of that IMPCB? if not, any email contact I can inquiry with? just curious on that IMPCB... Thanks.
Electronics Forum | Mon Apr 29 16:56:13 EDT 2002 | gsmguru
Look at: http://www.bergquistcompany.com/therm.htm The material is made by Bergquist Inc. All sorts of good stuff on their website. Look under Thermal Clad. Dave G
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El
Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon
| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ
