Electronics Forum | Fri Jul 06 10:11:02 EDT 2007 | blnorman
Solderability testing and if possible, measure the plating thickness (XRF).
Electronics Forum | Thu Jul 26 22:56:03 EDT 2007 | davef
And they're using a stencil that is how thick?
Electronics Forum | Mon Nov 19 14:23:32 EST 2007 | realchunks
BINGO! Now that's engineering!
Electronics Forum | Thu May 01 07:36:14 EDT 2008 | realchunks
Does the customer understand why underfill is used? I don't think you will gain anything on this QFN.
Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks
QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.
Electronics Forum | Tue Jul 01 13:40:32 EDT 2008 | gencinas
Thanks Real Chunks. Gpe.
Electronics Forum | Mon Mar 09 07:14:35 EDT 2009 | gregoryyork
wow enig is usually not associated with this failure
Electronics Forum | Fri Jun 12 14:28:17 EDT 2009 | isd_jwendell
Minimize scavanging by the attached trace and provide more uniform temperatures between all pads.
Electronics Forum | Wed Sep 30 13:10:49 EDT 2009 | spitkis2
Hi guys, Can someone please clarify whether adjustment of Z axis travel is a critical parameter during placement of QFN devices. If so, to within what tolerance? In other words, should a pick and place machine position a QFN down on the board so t
Electronics Forum | Fri Oct 16 14:11:16 EDT 2009 | davef
thermal and pad
