Electronics Forum | Tue Jun 21 07:39:23 EDT 2005 | davef
There's a fair amount of material on cooling rates for lead free on the web. Look here: * http://www.speedlinetech.com/docs/Cooling-Slopes-Lead-Free-Reflow.pdf * http://www.findarticles.com/p/articles/mi_qa3776/is_200412/ai_n9473486 * http://www.m
Electronics Forum | Fri Jan 19 07:26:45 EST 2007 | Richard-magictek Tech
kindly send me your reflow profile ---and also the PCB lay out i shall able to determine your process flow on speed....and glue application i can be reach at this email- rdm@magictek.com.cn my web site is ;www.magictek.com.tw we are furance maker w
Electronics Forum | Tue Feb 19 16:19:26 EST 2008 | edatasys
Check out http://www.solderstar.co.uk/wavePro.html This tool measures all key wave solder information with a single pass. Wave/PCB contact, immersion depths, etc. Also has a reflow pack to allow use on reflow, 9 channels with predictive software. B
Electronics Forum | Wed Feb 20 08:17:32 EST 2008 | ck_the_flip
Steve, KIC does. The new KIC2000 has built in dwell time sensors. You can buy KIC's wavesurfer option (like MOLE's waverider), or you can engineer a custom pallet for 1/3 the price. I made a custom pallet and took advantage of the KIC's automatic
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Wed Feb 07 16:16:10 EST 2007 | mr
I have seen this before. Check: --Vibration of belt --Interference (part getting "brushed off" while reflowing bottom-side components --Some glues' cross-linking mechanism is impaired by the flux during migration in reflow, redering the glue useless
Electronics Forum | Sun Mar 20 12:58:23 EDT 2011 | sellenzz
We have a Nitrogen Silo. Your going to want to be careful if you decide to use nitrogen, not only are the levels unstable most of the time but it can also cause your components to tombstone like crazy, especially if you run a lot of LED's. We run 24/
Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef
Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.
Electronics Forum | Mon Jun 20 21:54:38 EDT 2005 | darby
Contact your paste supplier and see what they say. My information on SAC 305 FROM MY SUPPLIER was - "The cool down rate is not as critical for Pb-free solder joints, as it was for SnPb. The grain sizes do not differ is size in the Pb-free bulk solde
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
