Electronics Forum | Wed Nov 21 04:08:12 EST 2007 | aj
Thanks guys. Chunks - how many zones do you have in your oven ?
Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0
hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6
Electronics Forum | Mon Jul 01 04:58:50 EDT 2019 | SMTA-David
Hi, I have been looking around for an 8 zone reflow oven with convection heating top and bottom and computer control for setting up and storing profiles. The Chinese company "Jaguar" have a couple of models at reasonable price that look like they wo
Electronics Forum | Fri Mar 29 15:43:26 EDT 2019 | tjs1634
We handle a similar SMTA quantity in house and use a 5 zone SMTmax AE-F530C 220V Single Phase Equipment Outline Size L-2000* W-612* H1220 mm Heat Zone Length 1000mm Equipment Weight 180kg Max power 7kW Belt Width 300 mm PCB Size 280x280 mm Comp
Electronics Forum | Wed Apr 17 15:31:25 EDT 2019 | noyart
At the company that I work at we have used rehm ovens and been very happy with the results. The one we have now has 8 zones with 2 to 4 cooling zones. I can check tomorrow what oven it is. The company produce a lot of different batches of PCBS, from
Electronics Forum | Mon Jan 20 03:59:27 EST 2003 | emeto
Hi Burb, I think you should try with paste which consist Ag.Or it might be other:Ag has different thermal characteristics, so you probably stay too long in the reflow zone.That's one reason for granular joints. good luck!
Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0
we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick
Electronics Forum | Wed Jun 15 10:30:18 EDT 2011 | SBecmpe
If you have the ability to control top and bottom zone temperatures verify that the difference in your peak area is 10 to 20 degrees. This will depend on the ovens capabilities.
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
