Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders
I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Fri May 15 10:12:21 EDT 2015 | capse
I'm the Rep for Vitronics Soltec and ASYS EKRA in the southeastern US. I suggest you take a look at Vitronics ovens. The AutoSet feature makes new profile development as easy as possible without buying a third party accessory, The new EKRA user inter
Electronics Forum | Mon Jul 19 11:11:18 EDT 1999 | Wolfgang Busko
| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still t
Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario
| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni
Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B
Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u
