Electronics Forum: seho go selective 2 (Page 11 of 14)

Re: Help with new placement equipment

Electronics Forum | Fri Oct 16 08:47:58 EDT 1998 | Scott Cook

John, I'll throw my bit of confusion into the pot, here. Your limited floorspace, coupled with your technology mix vs. volume mix narrows the scope of your search. You don't say what your budget is, or whether you are looking for speed. I'll give y

changing from no-clean to clean

Electronics Forum | Sat May 18 22:51:35 EDT 2002 | yngwie

First of all, my Customers can be described as a real "Jack-Ass" or at least the SQE does. They don't treat us as their partners OR more like "do what I said...When I started to use solder paste you probably weren't borned yet and/or probably still o

Component Plating/Oxidation problem

Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef

First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F

Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in

Re: Component Packaging Trends

Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc

Re: Mechanical stencil foil tensioning

Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani

| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so

Saponifier needed to stop

Electronics Forum | Sat Oct 06 08:32:09 EDT 2001 | davef

Mr. Wizard is not currently available. You get the wizzer. Maybe your dream date will show later. Get your own lab tests done. Show your potential customer that your boards are clean. That�s the issue. The issue is not how you go about cleaning

New Facility Advise/Questions

Electronics Forum | Sat Dec 28 06:58:33 EST 2019 | kylehunter

> yeah...I never had airflow volume problems with > Hellers. When I had to build the system I was > referring to, we had an old Speedline oven, and > the way it was configured if you didn't provide > enough airflow to the outer ca

Re: Environmental Issues

Electronics Forum | Fri May 22 11:56:04 EDT 1998 | Bill Schreiber

| | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recent

Re: Philips vs. Quad

Electronics Forum | Thu Mar 18 20:27:57 EST 1999 | Jim Muckle

| | | I'm in the process of selecting a medium speed pick & place machine. I need to place a wide range of components from 0805 | | | chips to a 144 pin MQFP (32mm square 25mil lead spacing). | | | | | | Anyway, I'm looking at the Quad QSA-30, the


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