Electronics Forum: silver and palladium (Page 11 of 13)

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy

Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information

Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford

AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no

When do you use Tin/Lead/Silver paste ?

Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef

Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol

Re: Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean

| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: Finishing myth ?

Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon

| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Re: Transient Voltage Suppressors

Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer

| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard


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