Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Industry News | 2012-04-26 14:34:00.0
With its software, Viscom offers many useful additional features to make using AOI/AXI inspection systems in electronics manufacturing faster and more convenient.
Industry News | 2021-06-02 05:34:04.0
EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2017-10-23 05:53:04.0
Selected Bob Willis webinars are released for the end of 2017 and the beginning of 2018. Book online to secure your place or for your team training. If the date or time does not suit your schedule its also possible to arrange online training at a time and date that is better for you http://www.bobwillis.co.uk
Industry News | 2004-09-22 14:23:28.0
Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2008-03-01 19:33:42.0
Nihon Superior�s unique SnCuNiGe solder, SN100C�, that has established itself as the best alloy for lead-free wave soldering, will now be available as a high-performance solder paste with a general purpose �P500� flux medium.
Industry News | 2014-03-04 12:06:53.0
Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada.
