Electronics Forum | Thu Aug 24 03:20:36 EDT 2006 | aj
we had problems with fillets and shifting aswell,but the recommended print aperture is reduce thermal pad by 35% and offset the lead print by 3thou...i.e. 3thou over hang on outer edge of lead which also moves the paste 3thou in from the inner edge .
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Tue Aug 20 13:01:48 EDT 2013 | sevenzero
I read through this thread somewhat and checked out the pictures. I've programmed TH lead checks on a newer Yestech and an older Mirtec. I personally use the Yestech white-top/histogram check and the only solder inspection Mirtec has. In my experienc
Electronics Forum | Wed Nov 20 09:27:28 EST 2002 | davef
There's a fair number of issues with lead and bismuth solder alloys: * Lead and bismuth alloys can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. Melting point of the eutectic alloy is 95�C [~96�C?]. * Fillet lifting of PTH du
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Tue Aug 22 12:56:29 EDT 2006 | Chunks
Russ is right. The pad in the middle needs to be soldered as well. Also, the ends of leads exposed are not plated as well, so you will never get a toe fillet. Drives our IPC experts nutty, or should I spell it "knutee"? I don�t know, I went to a
Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ
We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri
Electronics Forum | Fri Aug 02 18:30:45 EDT 2013 | hegemon
We use our Yestech and Mirtec to do that same thing. Verify the lead is in the hole and check the solder fillet. This is done as part of our normal solder inspection for mixed technology high runners. You may not be able to put together a program
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
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