Electronics Forum | Tue Apr 17 22:55:28 EDT 2007 | davef
Look for �Evaluating Solder Paste - not an Option� here: http://www.itmconsulting.org/smt_articles.html We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Sun Dec 28 15:19:49 EST 2008 | davef
A long time ago, Phil Zarrow wrote �Evaluating solder paste - not an option� to give tools for evaluating various solder paste properties. You are interested in �post placement tack.� Find Phil's paper at: * His site http://www.itmconsulting.org *
Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake
Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have
Electronics Forum | Sun Oct 17 09:27:58 EDT 1999 | Steve Restinetti (aka Bix)
Our SMT department uses Alpha Metals WS629 solder paste exclusively. Does anyone else use this paste and what do they think of it? I haven't evaluated other pastes yet and think that I'm sure there is something better out there. Feedback would be app
Electronics Forum | Thu Oct 16 00:08:31 EDT 2003 | Dean
Why would you have troubles if and when you switch? Isn't that the point of materials evaluation? Understanding the impact and material capability BEFORE "betting the farm on it". I would never stake my career on a solder paste without an Engineer
Electronics Forum | Fri Jan 25 18:22:03 EST 2008 | mobytahoe
We have evaluated (in-house) the following machines: Agilent SP50, CyberOptics SE300, Siemens OS. We have also evaluated the MVP machine and the Orbotech machine off-site. Best bang for your buck??? CyberOptics by far! Better Gage R&R, better standa
Electronics Forum | Thu Dec 30 23:25:49 EST 1999 | Henry C. Yao
We're using 96.5/3.5 high temp solder paste for our production and we're encountering soldering defects particularly non wetting (tombstoning). A technical document I read mentioned that there is a sort of a problem with the wettability of this paste
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Tue Jun 20 09:28:30 EDT 2006 | cuculi54986@yahoo.com
We evaluated four SAC305 pastes. Of the four, we found Alpha OM-338 to appear to have the least flux residue. We also found it to be the most dull, least shiny, most non-SnPb looking of the four.
Electronics Forum | Fri Jul 10 13:55:16 EDT 1998 | Bob Willis
After reflow the paste on a copper pad should spread out from its original print dimensions it should ideally not prior to reflow as that is a hot slump. The better the solderability of the OSP or the higher the activity of the flux will greter flow
