Electronics Forum | Thu Dec 07 11:49:28 EST 2006 | K
We currently have RMA and WS soldering processes here and do batch cleaning for both. We are experiencing some capacity issues and are interested in looking at an IN-LINE aqueous wash. My experience with in-line wash is only with WS. 1. Since RMAs
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F
Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Fri Jul 16 05:24:40 EDT 1999 | Chris May
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti
Electronics Forum | Thu Oct 11 14:56:27 EDT 2007 | chef
Thank you- my point exactly and it starts in SMT- operators pulling the wrong paste from the fridge, touch up using the wrong solder wire, etc. My solution- GET THE LEAD OUT!!!!! I'm a CM- high mix, low to medium volumes. No steady all day every day
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1
apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo
Electronics Forum | Tue May 05 13:44:57 EDT 1998 | Mark Mitchell
Mr. Desrochers; Philips EMT Americas offers a three day course entitled, "Introduction to SMT Manufacturing". The course addresses all major factors that influence the automated SMT assembly process. Topics that are discussed in the course are list
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