Electronics Forum | Mon Sep 01 02:24:10 EDT 2008 | omid_juve
we use another device with the same package but it doesn`t have any solderability problem . the things that we are hesitate on is the difference between the pin alloy in these two different packages . also i should say that in rework station it will
Electronics Forum | Wed Dec 14 09:03:28 EST 2005 | russ
See "black pad" and determine if that's what you have.
Electronics Forum | Fri Dec 16 07:22:18 EST 2005 | jax
Try paste flux instead.... oh yeah.. clean it as soon as it comes out of reflow.
Electronics Forum | Mon Nov 05 14:01:21 EST 2007 | dphilbrick
Not only a wizard but a damn good interrupter too there Dave.
Electronics Forum | Tue Aug 26 22:56:39 EDT 2008 | omid_juve
we have solderability problem(some pins aren`t soldered) with two devices in our board with the below detail EP1K30QI208-2 brand:ALTERA with the package PQFP-208 TMS320VC5416PGE160 brand:TI with the package TQFP144 these two devices are pb free but t
Electronics Forum | Wed Dec 14 06:32:20 EST 2005 | tk380514
Not all but some new boards we have had solder joint problems, for example some of the pads refuse to solder at all and the solder paste ends up attched only to the leg, reworking makes no difference and a variety of fluxes have failed. How can some
Electronics Forum | Mon Jul 11 08:35:54 EDT 2011 | scottp
I see bare copper on top of some of the leads. Maybe that's normal and acceptable, but I would look at the underside (solderable surface) of the leads on some bare parts to make sure they're properly plated. Poor solderability can be one cause of v
Electronics Forum | Fri Jan 16 12:03:46 EST 2009 | black5629
We are encountering similar problem as yesterdays posting, with solder not sticking to the pads but wicking to the leads on Leaded HAL finish boards, except we have tried two different solder paste lots with similar result. The oven profile and paste
Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu
CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.
Electronics Forum | Wed Jan 21 06:09:37 EST 2009 | gregoryyork
Try a typical Stencil Cleaner with Glycol ether mix as probably solder resist residue depositing back onto the pads during levelling. Cheers Greg
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