Electronics Forum | Mon Oct 14 03:14:08 EDT 2002 | msimkin
Hi, Has anyone had expereince in the design or use of mini rework srtencils for uBGA applications? What was the deisgn guide lines used. I am looking to rework 0.7 & 0.65 mm uBGA parts with standard hot air, without split prism placement guides. It i
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Mon Jun 02 15:03:05 EDT 2014 | clydestrum
Background on the PCB: Thickness: .032" Material: Standard Fr4 V-score: Leaves .016" (approx .008" cuts on either side) We are having some issues on these boards where the edges are delaminating all the way to the copper during de-panel. Now, we are
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
Electronics Forum | Fri Jun 18 14:06:15 EDT 1999 | John Thorup
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
