Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark
| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Wed May 04 03:12:02 EDT 2005 | Dr . Klein
Hello all. I need some advice for first article inspection process. I will explain my problem with this process: In our site we are doing a manually FAI before reflow for every assembly. One of the steps is to check the writing on each QFP or BGA (e
Electronics Forum | Thu Jun 04 12:26:30 EDT 1998 | Dave F
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Sun Jun 04 19:55:12 EDT 2006 | darby
Andy, What do you want to know?
Electronics Forum | Fri Jun 09 15:59:47 EDT 2006 | russ
Why you are a fine man there Larry Groves! Russ
Electronics Forum | Mon Jun 23 07:46:15 EDT 2014 | cyber_wolf
Get the Mydata programming manual. It will take you through the process step by step.
Electronics Forum | Mon Apr 02 06:03:36 EDT 2018 | tanisi2018
How to do SMT soldering using re-flow oven. Kindly provide step by step procedure.
Electronics Forum | Fri Jul 27 09:00:46 EDT 2001 | wbu
Hi Darby, you must have read my thoughts about the stuff we are dealing with. Think I�ve got to hide your message from my boss it may lead to the decision that I�m not allowed to read this and other forums anymore ;-). We still need optical inspect
Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika
These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,
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