Technical Library | 2020-10-08 00:55:22.0
This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.
Technical Library | 2023-06-02 14:13:02.0
This work examines the use of dual-material fused filament fabrication for 3D printing electronic componentsand circuits with conductive thermoplastic filaments. The resistivity of traces printed fromconductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillerswas found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with valuesspanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fracturedeasily, but the copper-based filament could be bent at least 500 times with little change in its resistance.Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filamenthad an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material3D printing was used to fabricate a variety of inductors and capacitors with properties that could bepredictably tuned by modifying either the geometry of the components, or the materials used to fabricatethe components. These resistors, capacitors, and inductors were combined to create a fully 3Dprinted high-pass filter with properties comparable to its conventional counterparts. The relatively lowimpedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wirelesspower transfer. We also demonstrate the ability to embed and connect surface mounted components in3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thusdemonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composedof either embedded or fully-printed electronic components.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
Technical Library | 2019-10-24 06:29:59.0
Making your novel electronic item design ready for mass fabrication and printed circuit board assembly consists of a lot of steps as well as risks. I will provide a few recommendations about how to neglect pricey errors and how to reduce the time to promote your novel item designs. You can hire printed circuit board assembly services for this. As soon as you have accomplished your product as well as printed circuit board design, you wish to get started developing prototypes prior to you commit to big fabrication volume. A lot of design software packages, for instance, PCB layout design software, as well as an industrial design software program, possess simulation potentials incorporated. Carrying out a simulation facilitates curtailing numerous design mistakes prior to the first prototype is developed. In case you are developing an intrusive item, you might desire to think about a modular design wherein all of the chief functionalities are situated in individual modules. All through your testing, you could then swap modules that don’t cater to the design limits. Spinning individual modules would be swifter and more cost-effective in comparison to spinning a complete design. Counting on the design intricacy, you can mull over manually mounting printed circuit board elements to bank dollars. Nonetheless, for medium to big intricacy this procedure likely to be very time taking, typically in case you wish to create numerous prototypes. Hence it makes sense thinking about a contract manufacturer for the assembly. Whilst running miniature quantity fabrication runs, the fabrication setup expenditure will usually control the by and large prototype constructs expenditure. Whilst seeking a subcontractor, it is finest to choose a vendor that focuses on prototype builds to reduce the cost. Prototype printed circuit board fabricators characteristically join the circuit boards of a number of clients which efficiently shares the setup expenditure in the midst of some customers. The disadvantage is that you would characteristically only be able to want among numerous standard printed circuit board material thicknesses as well as sizes. Apart from choosing a supplier with low setup expenditure, choosing a firm that would moreover be capable to manage your whole fabrication runs curtails mistakes because switching fabricators have the chance of errors owing to a specific supplier interpreting fabrication design data in a different way. This manner your design is already translated into the particular machine data that implies little or no setup expenditure for your final fabrication. A few PCB manufacturers also provide printed circuit board design services that are awesome plus if you do not possess experience with the design. Moreover, these vendors would be capable to help you in case there are issues with your design folders and be capable to detect issues prior to the fabrication.
Technical Library | 2019-05-23 21:56:56.0
Automatic on-line shoe sole spraying system: automatic shoe sole spraying system, simple and convenient operation, using 3D vision positioning system. Automatic recognition and automatic generation of spraying trajectory. Robot non-contact spraying gun is used to complete the process of shoe sole spraying with maturity, stability, high speed and high precision along the predetermined trajectory. The automatic generation of spraying trajectory is the realization of shoe sole spraying technology. Shoe sole spraying characteristics: 1.Positioning System: 3D Visual Positioning 2.Components: Intelligent Robot, Laser Scanner, Industrial Computer, Gum Spraying System, Conveyor Belt, Electrical Control System, etc. 3.Spraying time: slightly different according to shoe size and spraying time Fully automatic sole spraying advantages: 1. Simple application: suitable for soles of different specifications, models and sizes 2. Faster speed: 6-8 seconds to complete sole scanning and spraying, superior to similar products at home and abroad. 3. Quality stability: gum spraying trajectory is scheduled, gum dosage is fixed, gum spraying quality is greatly improved. 4. High cost performance: the same performance, the price is only 1/3 of the same type of equipment of European brand. 5. Reduce wear and tear: glue is fully utilized and not wasted, reducing human contact with glue. Intelligent operation advantage manual only need general operation can be automated workshop, mechanical arm automatic spraying glue, accurate spraying, reduce glue waste. Environmental protection effect of long-term close contact with glue seriously affects human health and mechanical work, glue does not directly contact, do not harm the human body. Fully automatic spraying, shoe sole adhesion process for automatic spraying machine, will not cause great challenges! With the deepening of personalized shoemaking, higher requirements have been put forward for the spraying technology in shoemaking process. The method of creating spraying trajectory must be adapted to shoes of different sizes and styles. The automatic generation of spraying trajectory is one of the key technologies to realize the automation of shoe sole spraying process. The method of off-line programming and real-time generation of spraying trajectory for robots based on the three-dimensional CAD model of sole and the data of sole. A new method of generating spray trajectory by scanning the sole of shoe upper with linear structured light sensor is presented. The feasibility of the method is verified by industrial robots. Aiming at the need of generating shoe sole spray rubber trajectory based on line structured light, the format standard of IGES file of three-dimensional model of shoe sole was tested. The shoe sole contour line and the shoe sole surface were extracted, and then the offset curve of the shoe sole contour line on the shoe sole surface was calculated to obtain the spray rubber trajectory. Three-dimensional profilometer is to use structured light to obtain sole information, effectively improve the automatic shoemaking spraying process, which will help to improve the efficiency of shoemaking, improve the quality of footwear products, and promote the development of personalized shoemaking.
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