Electronics Forum | Tue May 25 11:40:23 EDT 1999 | Steve Gregory
Just a note about cleaning stencils with a mixture of alcohol and water, especially if you're using no clean paste, it's really not recommended. Don't take my word for it, you can check with Alpha or most any other solderpaste vendor. What will actu
Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings
I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!
Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur
John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Tue May 18 14:47:02 EDT 1999 | Dave F
| Looking at the full convection reflow oven market, I see two segments, high mass heater ovens (i.e. Electrovert Omniflow,...), and low mass heater ovens (i.e. Heller,...) | Did some of you guys did some testing on both types and what were your find
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Fri May 14 13:42:21 EDT 1999 | andy blair
I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 people
Electronics Forum | Thu May 20 10:09:16 EDT 1999 | Eric Maddy
| I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 peop
