Electronics Forum: process (Page 1035 of 1146)

Re: BGA removal

Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F

| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman

| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 12:55:15 EST 1998 | N.J Bateman

| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Fri Feb 20 20:33:16 EST 1998 | Steve Gregory

The biggest difference between the two, is solder joint appearance. What I noticed mainly is that the solder does not wet and flow as readily to a palladium coated lead as it does with a tin/lead coated lead. When you look at a palladium coated lead

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Fri Feb 20 09:41:11 EST 1998 | Chrys Shea

| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre

Re: Reflow oven feedback

Electronics Forum | Wed Feb 25 02:50:33 EST 1998 | Scott McKee

| I am currently evaluating some different reflow ovens | for a future purchase. The manufacturers we are | looking at are Conceptronic, BTU, and Heller. Any | feedback on these manufacturers would be welcome. | I am particularly interested in: | 1

Re: I'm looking to find a traning course for PCB design & layout

Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY

In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using

Re: Double sided reflow

Electronics Forum | Wed Feb 18 12:08:04 EST 1998 | Eyal Epstein

Hi, I am from Celtronix Ltd. we are a provider of Odd Form assembly equipment and have gained a lot of experience in double side reflow, both the chemical side of it as well as the automatic insertion of all types of TH components in paste. Enclosed

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Jan 30 14:18:24 EST 1998 | M cox

| | Using metal squeegees on GSPs has caused premature stencil wear. Has | | anyone had any success with this combination? How much snap off did you | | use? We are using .5 mm pitch and have a no clean process. | I have been using lots of metal

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Feb 20 14:16:06 EST 1998 | Dave McFadyen

I've been using metal blades on several brands of printers over the past few years and have to agree with comments in other replies. Contact print is a must or you will tear slits in your stencils at the ends of the blade. Center-mounted (floating) s


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