Electronics Forum | Wed Nov 04 18:13:53 EST 1998 | Michael Allen
I assume that you're dealing w/ Universal's SMPI connectors (and possibly their cables too). We've fabricated "conversion boxes" to accomplish what you're trying to do. These boxes have a female SMPI plug on one side, a female SMEMA plug on the opp
Electronics Forum | Thu Nov 05 09:10:23 EST 1998 | smd
MA: my internet e-mail isn't working at the moment, but I'd really love to see the conversion you created. My fax is 716-256-0792. Do you have a Dek printer or Omniflow oven? Many thanks to you. | I assume that you're dealing w/ Universal's SMPI co
Electronics Forum | Mon Oct 19 23:02:21 EDT 1998 | john godfrey
| We have just recently started using the Overall Equipment Effectiveness (OEE) metric on our SMT lines. This measurement is the "equivalent percentage of time the equipment is being used to produce saleable product at the maximum machine rate." Th
Electronics Forum | Fri Oct 16 21:17:04 EDT 1998 | Scott McKee
| | With current soldering of stranded wires to pcb assy's the wire tends to be very brittle and can break with very little movement of the wire. We use a low residue cored wire. Anybody with advice or who has seen a similar problem/knows how to over
Electronics Forum | Wed Oct 14 16:58:30 EDT 1998 | Earl Moon
| It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | Q: Can you get away with spending 25K? 30K? H
Electronics Forum | Wed Oct 07 14:55:17 EDT 1998 | Joe P.
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Tue Aug 18 16:10:40 EDT 1998 | Earl Moon
| Question: | If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? | I'm currently running into this
