Electronics Forum: (4) (Page 105 of 662)

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 11:39:55 EDT 2003 | russ

How thick is your stencil? We print 16mil every day with type 3 paste 2 of which you have tried (Alpha and Kester) Stencil should be 5 mil. Russ

IR oven profiling

Electronics Forum | Wed May 14 17:56:19 EDT 2003 | bradlanger

Does anybody have any advice on how to get a decent profile out of a 4 zone IR oven? Should top heat and bottom heat be proportionate? Are there any tricks to use?

Number of times reworking

Electronics Forum | Mon May 26 19:25:47 EDT 2003 | bayanbaru

How many times can a populated board been reworked? What can go wrong (reliability) if the populated board is reworked more than 4 times?

Flex embedded into FR4

Electronics Forum | Wed May 28 12:31:18 EDT 2003 | larryk

This is our first experience with running embedded flexs. Our board supplier suggested that we prebake our assemblies before placing components. What does everyone else do? Is prebaking normal when a flex is embedded?

Flex embedded into FR4

Electronics Forum | Thu May 29 10:05:10 EDT 2003 | swagner

I hate to answer a question with a question but what are the particular effects of moisture absorption in a flex circuit?

15.7 mil QFP

Electronics Forum | Mon Jun 02 04:17:39 EDT 2003 | emeto

Hi Steve, Why are you so concerned about QFP(0.4) or BGA? If your equipment can manage, what's the difference? If you are designer do it better and use the cheaper or smaller package(you decide). If not use machine with vision recognition and your pr

15.7 mil QFP

Electronics Forum | Mon Jun 02 09:38:12 EDT 2003 | pjc

yo Evt, ".., what's the difference?". Answer: Huuuge!! between running 0.4mm pitch QFP and a BGA of same I/O, in terms of handling, storage, feeding (trays), p&p, inspection, test, rework, etc.......

Repairing balls on BGA's

Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto

Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck

Soldering FBGA Virtex-II XC2V6000-4FF1152C

Electronics Forum | Thu Jul 10 13:33:22 EDT 2003 | Louis

I am assuming that there may not be any other > parts on this board? > > Russ

Soldering FBGA Virtex-II XC2V6000-4FF1152C

Electronics Forum | Thu Jul 10 15:55:14 EDT 2003 | russ

Great point Stephen!! I failed to mention that little detail. Russ


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