Electronics Forum | Mon Mar 15 08:14:45 EST 1999 | Ben Kirk
Here is my question. We have several fuji CP's in our shop, every once in a while the first couple of parts placed are off the pads. When we move the parts further down in the sequence they are fine. What is going on? Has anyone had this problem and
Electronics Forum | Mon Mar 15 18:36:59 EST 1999 | Dean
| Here is my question. We have several fuji CP's in our shop, every once in a while the first couple of parts placed are off the pads. When we move the parts further down in the sequence they are fine. What is going on? Has anyone had this problem an
Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Fri Feb 12 14:06:28 EST 1999 | Craig Lowe
Bill, I would go with the second piece of advice by leaving a little film of solder paste on the screen. This is good advise if you are using a lookup/look down type of vision centering. Like on MPM and newer Fuji. On older Fuji GSP2/3 style printer
Electronics Forum | Mon Jan 18 11:19:18 EST 1999 | Ken Daniels
I have a severe problem with flux residue being drawn up the vent ducts of my reflow oven. This residue reaches a critical mass then begins to flow down the ducts and becomes very messy. I run a no-clean process and use IR oven. Has anyone else out
Electronics Forum | Thu Jan 21 20:58:19 EST 1999 | Todd Gilmore
Ken; my experience has been that eventually the flux builds up in the vents and then drips back down on the boards. For a simple oven with an air cooler the flux must go somewhere. Better in the ducts than in the oven. Just replace the ducts every ye
Electronics Forum | Thu Jan 07 18:20:08 EST 1999 | Ryan Jennens
Congrats, Steve!!!! There was never a doubt in my mind that you would get it. By the way, do you have any ideas how I could solder this BGA down when all I have to work with is a roll of duct tape, a swiss army knife, some fertilizer and
Electronics Forum | Tue Dec 22 13:56:20 EST 1998 | Michael Allen
Yes, you can adjust the board clamp speed by adjusting the flow control valve on both air cylinders (front and rear). You may also want to adjust the software delay for the conveyor so that it starts after the board is completely lowered. | Once
Electronics Forum | Fri Oct 30 08:22:57 EST 1998 | Michael Nguyen
I finally got my problem figured out on the bridging, the only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass the i
Electronics Forum | Wed Oct 28 15:34:45 EST 1998 | carlm
| Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | That information should be contained in the technical data sheets supplied by
