Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
Electronics Forum | Fri Mar 01 03:16:01 EST 2013 | grahamcooper22
Solder paste flux formulation can make a difference when soldering to nickel silver...due to the alloy containing metals that oxidise easily like zinc and nickel then the flux has to be able to cope with the surface oxidation when the parts are in th
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto
I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Mon Jul 29 19:39:57 EDT 2013 | hegemon
No problem running lead free without nitrogen. Careful profiling will take care of the soldering. Cosmetically, the Nitrogen reflow is superior for lead free, and we see much better wetting, better coverage of the PWB pads, and of course the smooth
Electronics Forum | Thu Nov 07 15:33:02 EST 2013 | mleber
Below are a few photos of an ongoing issue we are having with 1 pwb style. Some of the pads appear to have contamination that appears after the selective solder step. The joints are extremely hard to rework - almost impossible. We had the joints anal
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
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