Electronics Forum: level (Page 106 of 232)

How actually the process of Electrofoam Stencil?

Electronics Forum | Fri Jan 07 09:56:04 EST 2005 | davef

Electroformed stencil suppliers follow. The describe the stencil production process on their sites. * Aplpha Metals [ http://www.alphametals.com/products/ stencils/pdf/PG_Electroform_Stencils.pdf ] * Chepaume [ http://www.chepaume.com/electroforming

MYDATA Myspeed software is total junk

Electronics Forum | Wed Jan 12 09:19:06 EST 2005 | Scott B

If you go into 'Magazine' menu and select 'Hydra preparation' then select the layout you wish to optimise (thats the stinger, you can only optimise for a single layout). You will then be presented with optimisation options which can be adjusted ('sa

Evaporator for batch washer...

Electronics Forum | Tue Jan 11 11:50:35 EST 2005 | Shean Dalton

Consider these three potential causes: 1) too much sludge - if the sludge builds up around or over the temperature sensor, then the sensor does not get an accurate reading. 2) too much chemistry in the evaporation solution - Check the temperature a

SMT LED placement with Universal HSP 4791

Electronics Forum | Thu Jan 13 15:58:50 EST 2005 | clarkk

Vikt, I'm using the LED type (leaded form). The LED is domed, but the dome is on the bottom. The surface that the nozzle picks up on is flat, and the nozzle does not extend beyond the edge of the body. The problem is in the inspection, which is rejec

Double Sided Reflow

Electronics Forum | Thu Mar 17 10:24:43 EST 2005 | Bob R.

I can't answer your question directly, but we're an automotive supplier and we don't do dual reflow with QFPs because of their moisture sensitivity level. We don't have the processes in place to manage the time between first and second pass so we'd

Hot Air Rework Issue on Nearby Components

Electronics Forum | Wed Mar 30 15:29:37 EST 2005 | Mark

I am not an expert however, I don't see any issues with this. Those joints of nearby components will melt and solidify back once they go below 183 C. Don't see how this could present quality issues as components may pass through reflow several time

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel

Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t

Lead-Free SMD repair

Electronics Forum | Sun Jun 12 15:45:12 EDT 2005 | Olof

Hi, We have just recently ordered a pre-heater for repair. Our concerns is: What temperature shuld we working with? I reckon that it shuld/must be between 80-100 degr. Celcuis? And also; How are we dealing with the MS-level (RoHS compliant) componen

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts

What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first

A.O.I - Design - Brainstorm

Electronics Forum | Wed May 11 08:41:46 EDT 2005 | Rob.

Cheers Jerry, forgot the most important one! Also want it to do: laser 3D volumetric solderpaste inspection Pre-reflow (including fault logging by placement machine & individual feeder) Post reflow solder joint inspection & handle lead free joints


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