Electronics Forum | Thu May 21 22:15:05 EDT 1998 | Earl Moon
| | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently
Electronics Forum | Fri May 22 11:56:04 EDT 1998 | Bill Schreiber
| | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recent
Electronics Forum | Fri Aug 17 06:40:27 EDT 2001 | nifhail
Thanx Dave/Hussman.. We normally store our solder paste in the refrigerator at 0-10 Deg C as per what the supplier recommanded. Our floor temperature is controlled at 22 +/- 5 Deg C and Humidity is at 55 +/- 5%. Recently we have customer asking fo
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef
In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
Electronics Forum | Tue Jul 23 23:22:25 EDT 2002 | kenbliss
Quite an assortment of opinions and problems, I appreciate everyones input. Based on all that I created a process below that seems to me should work well to reduce these problems. There seems to be plenty of blame to go around for everyone in the f
Electronics Forum | Thu Apr 10 09:28:14 EDT 2003 | chrissieneale
Thanks for your replies guys, there's some good info there. Dave, answers to your questions: The stencil was initially a big problem as with the Egineering Model's (EM's) and Engineering Qualifing model (EQM's) we kept getting short circuits due to
Electronics Forum | Mon Apr 21 13:48:32 EDT 2003 | davef
ISO 9001-1994 and ISO 9001-2000 are significantly different regarding 'process'. In the 1994 version, processes were considered to be routine manufacturing processes [eg, drill a hole]. In the new ISO, a 'process' is more global and covers anything
Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef
First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I
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