Electronics Forum | Mon Oct 31 20:35:58 EST 2005 | milroyperera
If I brief shifting, I checked the component before it enter the reflow oven and saw that the IC is perfectly aligned on the pads but when it comes out from the oven the IC is floated on the pads. The floating is irregular and the IC is shifted away
Electronics Forum | Sat Nov 05 01:22:23 EST 2005 | koeka
All, We are having insufficient hole fill only at DIMM connector area(120 pin/row total two or 4 rows at that area) when we switch to lead free (SAC and Sn/Cu). The finish we using is immersion silver. Preheat on top side ~98-118oC. Rosin flux type.
Electronics Forum | Thu Nov 10 13:55:25 EST 2005 | 1st Article
Milroy, Another thing to look at is your wave profile. Check speed and pre-heat, if flux gets burned off before reaching the wave then bridging is expected, a common way to check for speed is to time the point of first contact through the sub-merge
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Mon Nov 14 08:57:14 EST 2005 | James
Hello, I am looking at a manual solder bath that the operator will dip the boards into. We looked at the cost of a wave machine but it is not in the budget for this year so we would like to go with the static bath method. I was hoping someone would b
Electronics Forum | Tue Nov 15 10:19:27 EST 2005 | James
Can I dip the populated board in flux and achieve good results? Also how easy is it to clean the flux off the board afterwards if it is waterbased? Do you simply brush the board with a damp brush or spray some remover on the board? I also have this q
Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef
We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
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