Electronics Forum: downs (Page 108 of 462)

solderability test

Electronics Forum | Sun Mar 03 22:15:13 EST 2002 | caldon

RPS (Robtic Process Systems - I think) Makes a system called a Wet Balance tester. This machine is useful for Solderability on PCB sections and Components. Also for more info please go to http://www.empf.org/html/empfset.htm and down load Decemeber

Missing component benchmarking

Electronics Forum | Thu Mar 14 17:28:35 EST 2002 | stepheno

I worked with Fuji CP6 where one of the techs wanted a minimum of part data's. He was used to working with panasonic machines. We would get resistors broken in two if the part data was too small and parts flying off the board if the part data was t

Missing component benchmarking

Electronics Forum | Thu Mar 14 23:20:05 EST 2002 | alanwilson

Missing and misplaced components could be down to board supports set too high or too low. Check the ZO and make sure the deflection is set ok at various points across the board. Check the other usuals such as sticking nozzles, correct size nozzle for

POST REFLOW BALLING

Electronics Forum | Thu Mar 14 21:54:23 EST 2002 | alex_kirichenko

Try looking at your reflow profile. If he slope is too steep you may get solder balls. I've had the same problem, had to slow down the profile a bit. If you'd like, there was discution on wave soldering chart.. and Speedline one hase some points f

BGA underfill necessary with conformal coat?

Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef

Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr

Profiling board

Electronics Forum | Thu Mar 28 10:11:00 EST 2002 | cyber_wolf

I use a .059" copper clad sheet of FR4 that I bought from one of our board houses. It has not started to delaminate yet, and it has been through our ovens several hundred times. I am not sure what the life expectancy of a thermo-couple is. I am not 1

double side reflow soldering

Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch

Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to

Cutting 24 mm Feeder Tape

Electronics Forum | Wed May 08 10:05:42 EDT 2002 | Claude_Couture

Maybe the problem is not the cutter, but the arm that advance the tape in the adjacent feeder gets actuated at the same time as the active feeder. line-up a feeder in pickup position visually, then turn the crank until the roller or feeder advance me

stencil design software

Electronics Forum | Fri May 17 11:36:37 EDT 2002 | Hussman69

Hmmm... Why would you want to to this? I understand your concern, but why not let your stencil house manipulate your Gerber and send you a copy of it before they cut a stencil? Saves you time and money. Sit down with your stencil manufacturer and

Au Plating

Electronics Forum | Wed May 29 15:44:59 EDT 2002 | Jacob Lacourse

Hi, All Our board design requires us to selectively plate some connector pads with gold. The problem is we have changed board houses and they charge a heafty amount to mask the rest of the board. One option is to allow them to plate the whole bo


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