Electronics Forum | Wed Nov 17 12:12:30 EST 1999 | Wendy Casker
Well, I was using a quad QSV-1 for boards this size. Not the fastest, but it was able to handle the large boards in a pass through machine. Keep in mind the board thickness, as well. Anything over 0.2" will not fit in the clamps of the conveyors.
Electronics Forum | Tue Nov 02 09:29:21 EST 1999 | Wolfgang Busko
Hi Kevin, you could use a fixture for supporting the assembly. I think it�s a common solution for thin PCBs. For the design you could search the archive there are some tips on this already ( search for support, fixture, pallet ). hope this helps Wo
Electronics Forum | Fri Oct 08 11:48:23 EDT 1999 | Jim Prestridge
I'm searching for a source for surface mount socket savers that accept a hand test socket (Yamaichi, Nepenthe etc...). Barring availibity of an SMT socket saver does anyone know a good technique for soldering socket savers into a .250" thick, 20+ lay
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Tue Sep 14 13:49:14 EDT 1999 | Earl Moon
| I am looking to find a formula to calculate the resistance of circuit traces based on width | The old MIL-STD-275 became IPC-STD-275 became IPC-2221/2222. Anyway, they had/have simple graphic representations converting AWG standards into equivalen
Electronics Forum | Thu Sep 02 08:06:01 EDT 1999 | Wolfgang Busko
| | I'd like to know the advantages and disadvantages between the two. | | | | Thanks and regards, | | However, I really like aperture reduction best after running the experiment while using .006" thick foils as the practical limit. This really w
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Wed Jun 09 12:20:26 EDT 1999 | Gang Pan
I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. There is anybody has experience on metal-based PCB reflow process? I guess pre
Electronics Forum | Sat Jun 12 08:50:41 EDT 1999 | Dave F
| I am trying to find out as much information as possible relating to conductive inks. | | If anyone out there is using them please give some advice. | | 1) How are you curing the ink? | 2) What type of substrates are you using and who supplies
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
