Electronics Forum | Sun Nov 22 13:58:45 EST 2009 | tpappano
I didn't attempt to get any written guarantee, but took a leap of faith based on our various communications. The broker was also a refurb operation so I figured we could resolve any technical problems without too much trouble. At this time I'm also
Electronics Forum | Fri Nov 20 08:51:34 EST 2009 | Sean
Hello, This is interesting topic that I would like to share and discuss with you.. I came across few projects from various SMT factories where its product(Computer) reach field, experience No Post/boot defect. This problem become very obvious when
Electronics Forum | Sat Feb 27 00:59:43 EST 2010 | jmelson
Hi, I have a CSM84, PA1306/20. When I got it, a lot of the offsets had been zeroed out. I figured out a procedure to calibrate the back feeder rail, but haven't come up with a scheme to calibrate the mechanical alignment unit. I have it close, but
Electronics Forum | Thu Feb 11 18:51:49 EST 2010 | rodrigo
Hi All, I'm setting up the F4G software for our line (currently using MCS30). I made an adapter to connect the CP4 line (that was connected to the MCS30) to the PC. Then I tried to transmit a program but I keep getting this error: 41A27F9D: Error o
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist
We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X
Electronics Forum | Fri May 07 15:23:24 EDT 2010 | hegemon
We are evaluating Vapor Phase right now, and there is something that bothers me a bit. The machine has a preheating stage where we can bring the board, components and paste up to temp to dry the paste out before descending into the Vapor. The heatin
Electronics Forum | Mon Jun 07 15:33:08 EDT 2010 | bderks
Hi, I'm working at a very small electronics assembly firm and we need to get a better thermal profile of our reflow and solder wave ovens. Our firm is part of a larger firm that was set up to help handicapped people find work in the Netherlands. Yo
Electronics Forum | Fri Jul 09 19:09:52 EDT 2010 | rway
A couple of things: Does the cap break if you try to remove it with hot air? If not, than you are breaking the caps do to mechanical stress. We have had similar issues. I don't think your board is suffering from mechanical stress from depaneling o
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
