Electronics Forum | Fri Feb 18 21:34:36 EST 2000 | gwen
We always have big power modules on the board,they are very heavy,so we use the screw to fix the soldered module,then we destroyed the solder joints.If we screw them first, the board can't be wave soldered. My questions: whether we should use the s
Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Electronics Forum | Mon Jan 15 10:32:18 EST 2001 | johnthor
I have to agree with you Wolfgang. Admittedly it's my first look at it but I don't think my opinion will change much. At this point I wish I had taken the time to respond to Brian's request to beta test the "new" site. Maybe I could have made a di
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Mon Jan 29 10:26:21 EST 2001 | CAL
David- The information you ask about is what we deal with on an every day basis. We can entertain your questions off line at your convenience. The POC here at ACI you need to speak with is Mike Czajkowski (CHI-Kow-ski). He should be able to provide d
Electronics Forum | Mon Jan 29 04:27:47 EST 2001 | wbu
Hi Sal, taking the dwell time as parameter to control seems to me unessary. Dwell time is a function of other settings that can be controlled (adjusted) more easily (conveyor speed, wavehight-settings, angle). Although dwell time is essential it�s I
Electronics Forum | Tue Jan 30 12:03:15 EST 2001 | slthomas
Pete, I'm wondering how much optimisation you needed (or were allowed) to do with respect to connector design. The first one we evaluated had a row of leads that I can only describe as "crescent" shaped in cross section. Impossible to get even 50%
Electronics Forum | Wed Jan 31 17:04:22 EST 2001 | williamh
Hello all, I am having a problem with solder balls on chip resistors and chip capacitors. I have searched the archives and found some information concerning solder balls but have a couple more questions. 1. What is the realistic industry standard f
Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
Electronics Forum | Wed Feb 14 15:55:31 EST 2001 | Antonio
Fellas, Here's the deal. We're getting shorts on a limited number of boards under the BGAs; about 1 out of 6 boards. The thing is that these boards have about 10 BGAs on them. On the one out of six boards with shorts, the shorts are everywhere and
