Electronics Forum: bga reflow profile (Page 110 of 382)

Trouble reworking Xilinx 4044XL BGA chip

Electronics Forum | Wed Jan 17 20:33:19 EST 2001 | davef

The corner balls are supposed to collapse, but at roughly the same time as the other balls collapse. Also, those balls are located in the place that isthe easiest to get hot. Think about cranking-up the bottom heat, waiting, and slowing down the pr

Re: BGA Profile

Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach

| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl

A BGA reports (RoHS related of course)

Electronics Forum | Tue Feb 13 14:33:16 EST 2007 | CK the Flip

So the moral of the story is..... these SAC305 BGA's were accidentally mixed in with a Leaded process, the profile couldn't get hot enough due to Tg and Td constraints on a known good QFP on the same board, and consequently, the whole assembly fail

micropad solder problem ?

Electronics Forum | Sat Nov 03 09:39:27 EDT 2007 | davef

Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused Start your thermal

BGA drop off from the boards

Electronics Forum | Fri May 23 15:33:39 EDT 2014 | hegemon

I don't see any visuals that make me think of black pad phenomena. I do note that it appears that pads on the BGA itself have detached and been left on top of some of the solder balls. To me it looks like the temperature profile is not correct, not

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon

| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u

Question on Reflow Profile Development

Electronics Forum | Wed Jun 13 21:32:26 EDT 2001 | davef

One or more of the oven profiler companies [eg, KIC, ECD, Datapaq] has software for estimating profiles. Checkem aut.

thermal profiling tool

Electronics Forum | Thu Apr 09 12:11:19 EDT 1998 | raymond

Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ?

Re: thermal profiling tool

Electronics Forum | Thu Apr 09 12:35:16 EDT 1998 | Earl Moon

| Does anyone has any experience using the Prophet Thermal Manager by KIC Thermal Profiling for real time monitoring and control of reflow oven profile ? Yes. What is your concern. Earl Moon

Reflow Specs.

Electronics Forum | Tue Aug 14 21:29:29 EDT 2001 | mugen

Hi, Just to clarify the terms, traditional : aka : Ramp-Soak-Spike (RSS) profiling method tent : aka : Ramp-To-Spike (RTS) profiling method By search engines (eg. Yahoo), you can find more example profiles for your ref.


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