Electronics Forum | Mon Mar 13 15:02:43 EST 2000 | Boca
Breakaways are clearly the best solution for us in manufacturing. A big difference between wavesolder pallets and SM pallets is the need for a flush top surface for stencil to PCB contact in the printer. One vendor has a device which hold the PCB
Electronics Forum | Thu Jul 13 21:12:41 EDT 2000 | Dason C
Hi! Larry, absolutely "NO". When you move the component out from the refridgerator, the moisture will condensed to the surface. The Eureka Dry Box is different, it use special desicannt in the drying module to absorb the moisture inside the box and
Electronics Forum | Fri Mar 03 14:01:49 EST 2000 | dean
This technique is commonly known as "black boxing". The majority of IC's are marked with ink. Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. This will work with Laser marked parts as well. If your volum
Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F
Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
Electronics Forum | Tue Apr 03 13:27:58 EDT 2001 | mparker
go to http:\www.ipc.org. get the following standards: IPC-A-600F Also look at the IPC-6010 series, this may help with your design group. Finally, consider getting IPC-SM-782 and IPC-7525. These are for Surface Mount Design & Land Pattern Standards
Electronics Forum | Wed Apr 18 20:47:45 EDT 2001 | Dreamsniper
Hi Mr. Parker, Let me continue... "We, the people of Electronics Manufacturing Industry, in order to make a more perfect termination and to be able to produce a reliable interconnect, do solemnly swear that from this day onwards we will be using so
Electronics Forum | Fri Apr 20 07:30:14 EDT 2001 | wbu
In short: the measured deviation / the length this deviation occurs * 100% = % of deviation Actually we encounter mostly "twist" so we put the board on a flat surface, hold it down at the corners to see if any of the corners lifts, measure the heig
Electronics Forum | Fri Aug 30 04:53:08 EDT 2002 | jason
Hi Dr Lee, Recently, I was assigned to use Ag imm. PCB using 63/37 solder paste without Ag. The results were not fantastic. Surface finish was rough and lots of wetting issue. The oven profile soaking time was set at 70 secs above 183�C and Max tem
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