Electronics Forum: get (Page 1097 of 1323)

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 14:03:33 EDT 1999 | Earl Moon

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon

| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |

Re: A Blurb about Fujicam

Electronics Forum | Thu Jul 08 15:42:57 EDT 1999 | Earl Moon

| Snip | | John, | | | | You said a bunch. My biggest problem running Fuji, Panasonic, or Sanyo high speed stuff is that they are meant to run free. They are meant, in my mind, to run as thoroughbreds. | | | | I watch 6" reels placed on feeders, pl

Re: Water Batch Cleaners

Electronics Forum | Mon Jun 28 13:12:34 EDT 1999 | Graham Naisbitt

| | We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff component

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean

| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We

Re: bare board problem

Electronics Forum | Thu Jun 17 20:48:18 EDT 1999 | Earl Moon

| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.

the facts on our server

Electronics Forum | Wed Jun 16 10:44:04 EDT 1999 | Clifford Peaslee

Brian, Thanks for your concern, and maybe there is fear that we are trying to mislead people, which is not true. We do not have the server in house here in Portland, Maine. It is in Fort Lauderdale, Florida, at Advances.com. We are sharing a netw

Re: Dilbert-Like Episodes in Manufacturing... (i need to vent...)

Electronics Forum | Sat Jun 05 00:02:24 EDT 1999 | Dean

| Any of you Process/Manufacturing Engineers, techs, etc..or those of you who 'have a clue' about this stuff been victimized by (clueless and uneducated) Manufacturing Supervisors and (clueless and uneducated) Managers who blame EVERYTHING on YOU, th

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox

| | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo


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