Electronics Forum | Mon May 15 10:32:50 EDT 2006 | russ
Have you tried Indium corp?
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef
We agree with Chunks
Electronics Forum | Thu Nov 30 15:53:39 EST 2023 | emeto
Pin diameter plus 0.3mm
Electronics Forum | Wed Mar 20 15:06:07 EDT 2024 | linux
0.3 perfect, thanks to all
Electronics Forum | Wed May 02 04:04:18 EDT 2007 | greg york
What aload of rubbish - prove it, we have over 320 users in the UK alone using the SACP0307 solder with great results, and the biggest advantage they have is they can multiple source the solder not stuck to one company who has purchased the patent an
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Mon Jul 25 16:03:44 EDT 2005 | pjc
August Technologies, http://www.augusttech.com Taiwan: 7F-9, No. 81, Shuei-Li Road Hsinchu, Taiwan 0300 Tel: +886 (0)3 516 9230 Fax: +886 (0)3 516 9231 Korea: KoMoFo Tower 4F #16-3, Sunae-dong, Bundang-gu Seongnam-si, Gyeonggi-do 463-825 Korea Tel
Electronics Forum | Wed Apr 20 18:13:32 EDT 2005 | greg york
With twenty five machines working with the LFB227/S on our little island it does seem to work well. Wetting is good compared to Tin/Copper and flow is comparable to 63/37. Biggest problem sticking 3 - 4 % Ag in a solder ignoring the patents and royal
