Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
New Equipment | Board Handling - Conveyors
PCB Flipping Conveyor For Dual-side SMT Process from SZTech-SMT, it can flip PCB to the other side and send it to the next process of the SMT production line. Main specifications of PCB Flipping Conveyor Specification FC-350W FC-460W
New Equipment | Board Handling - Conveyors
PCB inverting Conveyor For Dual-side PCB mounting or PCB coating Process from SZTech-SMT, it can invert PCB to the other side and send it to the next process of the SMT production line, PCB coating production line, and also PCB laser production line.
New Equipment | Board Handling - Conveyors
Automatic PCB inverter / flipper Features ▶User friendly 'soft-touch' LED control membrance control panel. ▶Enclosed design with turn limiter ensures highest level of safety. ▶Top cover can be opened for easy access to hardware during maintance. ▶Pa
PCB solder paste printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD) for Reflow Soldering. Automatic PCB solder paste screen printer with pecial
solder paste printing is a critical step in the SMT PCB production, Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly,high q
High Speed PCB solder paste printer SMT Automatic Visible PCB Screen Printing machine for PCB Product Line. ASCEN PCB solder paste printer Support glue printing, automatic control improves production efficiency, quality control and saves pr
ASCEN Auto PCB solder paste printer SE700 model is a very accurate fully automatic SMT stencil printer. It includes a powerful AT-align automatic fiducial finding and PCB board offset adjustment system. After pressing the start key, the PCB
ASCEN Automatic stencil printer greatly improve its accuracy and performance. Now the design of the circuit substrate is fine and small.Most electronic product manufacturers in the market are switching to automatic or fully automatic solder past
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.